Bhubaneswar: India is taking a huge step forward in making computer chips. Tomorrow, leaders will lay the foundation stone for a new semiconductor factory. The factory will be located at Infovalley-2 in Bhubaneswar, Odisha. This event marks a very important day for the state and the country. Chief Minister Mohan Charan Majhi will attend the special ceremony. Union Minister of Railways, Information and Broadcasting, and Electronics and Information Technology, Ashwini Vaishnaw, will also join him. The State Minister for Electronics and IT, Mukesh Mahaling, and other important guests will participate in the event as well. 
The new project is called the Heterogeneous Integration Packaging Solutions. People also know it as the 3D Glass Solutions (3DGS) project. This will be the very first advanced glass semiconductor packaging factory in India. The project will bring the newest chip packaging technology from around the world straight to India. Because of this, Odisha will become a top leader in making the next generation of semiconductors. The Union Cabinet approved this project recently. Now, the state is starting the construction work very quickly. This fast action shows the government's strong dedication to the plan.
The company will invest about 1,943 crore rupees into this big project. This large amount of money will help the local economy grow. The new factory will also create many new jobs for the people. In fact, it will offer more than 2,500 direct and indirect jobs. The factory will have a very large production capacity. Workers will produce 50 million assembled chip units there every single year. Tech companies will use these advanced chips for many important applications. They will use them in space exploration and national defense systems. They will also use them for Artificial Intelligence (AI), fast 5G mobile networks, and large data centers.
This major milestone will make the semiconductor industry in Odisha much stronger. Odisha is now making history. It is the first state in India to secure two special technology facilities. First, it will have a compound semiconductor fabrication unit. Second, it will host this advanced 3D chip packaging center. This new center uses special glass materials to build the chips. The Odisha government wants to bring more high-tech businesses to the state. They want to attract investments from global companies. They also aim to build a strong, modern economy. This goal perfectly matches the vision of an Atmanirbhar Bharat, which means a truly self-reliant India.
The national government is also working hard to help this industry grow. They run a large initiative called the Semicon India program (ISM-1). Under this program, the Union Cabinet has approved financial help for 10 different semiconductor projects across the country. Companies will invest a total of more than 1.6 lakh crore rupees into these 10 projects. The national plan is already showing great results. Two of these factory units have already started making products for commercial sale in the last quarter of the year 2025-2026. India is clearly becoming a powerful player in the global technology world.
The new project is called the Heterogeneous Integration Packaging Solutions. People also know it as the 3D Glass Solutions (3DGS) project. This will be the very first advanced glass semiconductor packaging factory in India. The project will bring the newest chip packaging technology from around the world straight to India. Because of this, Odisha will become a top leader in making the next generation of semiconductors. The Union Cabinet approved this project recently. Now, the state is starting the construction work very quickly. This fast action shows the government's strong dedication to the plan.
The company will invest about 1,943 crore rupees into this big project. This large amount of money will help the local economy grow. The new factory will also create many new jobs for the people. In fact, it will offer more than 2,500 direct and indirect jobs. The factory will have a very large production capacity. Workers will produce 50 million assembled chip units there every single year. Tech companies will use these advanced chips for many important applications. They will use them in space exploration and national defense systems. They will also use them for Artificial Intelligence (AI), fast 5G mobile networks, and large data centers.
This major milestone will make the semiconductor industry in Odisha much stronger. Odisha is now making history. It is the first state in India to secure two special technology facilities. First, it will have a compound semiconductor fabrication unit. Second, it will host this advanced 3D chip packaging center. This new center uses special glass materials to build the chips. The Odisha government wants to bring more high-tech businesses to the state. They want to attract investments from global companies. They also aim to build a strong, modern economy. This goal perfectly matches the vision of an Atmanirbhar Bharat, which means a truly self-reliant India.
The national government is also working hard to help this industry grow. They run a large initiative called the Semicon India program (ISM-1). Under this program, the Union Cabinet has approved financial help for 10 different semiconductor projects across the country. Companies will invest a total of more than 1.6 lakh crore rupees into these 10 projects. The national plan is already showing great results. Two of these factory units have already started making products for commercial sale in the last quarter of the year 2025-2026. India is clearly becoming a powerful player in the global technology world.
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